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Patent # Description
US-6,723,172 Method and system for processing semiconductor wafers
A method for processing semiconductor wafers includes processing a semiconductor wafer in a processing chamber having upper and lower chambers, decoupling the...
US-6,722,210 System and method for measuring air flow at multiple points of an air channel
A device measures air flow at multiple points in an air channel. The device includes a metering plate that has multiple passages through the metering plate. The...
US-6,721,774 Low power multiplier
A digital multiplier 110 for multiplying a plurality of multiplicand signals X0-X23 representing a multiplicand and a plurality of multiplier signals Y0-Y23...
US-6,721,710 Method and apparatus for audible fast-forward or reverse of compressed audio content
A method for performing audible fast-forward or reverse of audio content represented in a compressed format, such as, but not limited to, MPEG-1 Layer 3 (MP3) or...
US-6,721,687 Electronic device evaluation system
An electronic device evaluation system (100) includes a potential customer located at a site (102) that accesses a company site (106) via a computer network such...
US-6,721,428 Automatic loudspeaker equalizer
A method for generating digital filters for equalizing a loudspeaker. First digital data is provided, for a tolerance range for a target response curve of sound...
US-6,721,295 Triple data system for high data rate communication systems
A slot-aligned IQ data buffer scheme has a third buffer that allows a processing engine to slide the selection of a vector to be processed so that it aligns with...
US-6,721,217 Method for memory sensing
Methods are disclosed for reading data from memory cells such as a ferroelectric memory cell in a memory device, where one sense amp bitline is coupled with a...
US-6,721,200 Dummy cell structure for 1T1C FeRAM cell array
A ferroelectric memory structure is described for the 1T1C arrangement in a ferroelectric capacitor cell array for FeRAM memory device applications. The device...
US-6,721,119 System and method for controlling an actuator motor during retract
A system and method are provided for controlling operation of an actuator for retracting a read/write head of a hard disk drive system. One aspect of the system...
US-6,721,115 System and method for enhancing write driver performance
A technique for presenting an optimally timed control signal to an upper H-switch driver in a fashion capable of achieving a very fast transition of the current...
US-6,720,959 Area efficient, low power and flexible time digitizer
A non-linear time digitizer delay chain and a respective lookup table for converting the phase error into a digital code together prevent a phase error pulse...
US-6,720,856 Calibration structure for circuit breakers having bimetallic trip member
A thermally compensated circuit breaker has a movable contact assembly (24) which mounts a movable electrical contact (24m) for movement between open and closed...
US-6,720,825 Method and circuit for reduction of audible turn-on and turn-off transients in switching amplifiers
A system and method for reducing audible turn-on and turn-off transients in switching amplifiers employs a frequency shaped start sequence in front of a...
US-6,720,788 High resolution current measurement method
The present invention provides a system and method for high resolution current measurements of an integrated circuit (13). With the present invention, no DFT...
US-6,720,780 High density probe card apparatus and method of manufacture
A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles...
US-6,720,749 Three-phase motor protector apparatus
A three-phase motor protector uses two toroids to monitor all three phases of a three-phase motor. Current and phase loss are monitored directly in phases A and...
US-6,720,574 Method of testing a semiconductor chip
An apparatus for testing a semiconductor die and the method wherein there is provided a package having a cavity therein with a plurality of terminals in the...
US-6,720,255 Semiconductor device with silicon-carbon-oxygen dielectric having improved metal barrier adhesion and method of...
A method (100) of fabricating an electronic device (200) formed on a semiconductor wafer. The method forms a dielectric layer (226) in a fixed position relative...
US-6,720,247 Pre-pattern surface modification for low-k dielectrics using A H2 plasma
A low-k dielectric layer (104) is treated with a dry H.sub.2 plasma pretreatment to improve patterning. Resist poisoning occurs due to an interaction between...
US-6,719,387 Method for reducing turn-off propagation delay in print head drivers
An improved inkjet print head driver. The driver includes a source of predrive charge for a first, drive transistor coupled by its source and drain between an...
US-6,718,544 User interface for making compiler tradeoffs
A user interface that allows a user to visually understand, inspect, and manipulate a compiled application program as a function of compiler options, such as,...
US-6,718,227 System and method for determining a position error in a wafer handling device
A system for determining a position error in a wafer handling device includes a control module, an image acquisition module, and an image analysis module. The...
US-6,717,826 Method to reduce bus voltage stress in a single-stage single switch power factor correction circuit
The present invention provides an apparatus and method for reducing the voltage stress in a single-stage single-switch (SSSS) converter by modulating the...
US-6,717,530 Multiple temperature threshold sensing having a single sense element
A temperature sensing system (30) that providing at least one detect signal related to temperature in an integrated circuit is presented. This system uses one...
US-6,717,466 Comparator
A comparator includes a differential amplifier stage comprising two emitter-interconnected bipolar transistors whose bases form the two inputs of the comparator,...
US-6,717,456 Level conversion circuit
A high-frequency compatible bidirectional level conversion circuit in which high-voltage port A and low-voltage port B are connected using pass transistor 12,...
US-6,717,429 IC having comparator inputs connected to core circuitry and output pad
As IC circuit density increases, the testing of ICs becomes more complex and costly for the IC manufacturers. A test system and method achieves cost reduction in...
US-6,717,393 System for difference calculation using a quad slope converter
A system for measuring signals in a non-linear network is provided which reduces the reliance on hardware and processing support when correcting for A/D offset...
US-6,717,276 Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and...
The present invention comprises a low cost device (10, 20) and a method (30) of forming an electrical interconnect between two metal substrate layers configured...
US-6,717,225 Integrated thermal difference sensor for power dissipating device
A Seebeck effect thermal sensor is formed in an integrated fashion with a power-dissipating device such as a power MOSFET. The integrated device generates a...
US-6,716,709 Transistors formed with grid or island implantation masks to form reduced diffusion-depth regions without...
A method of forming two regions having differing depths using a single implantation process is provided. A mask having two openings associated therewith is...
US-6,716,695 Semiconductor with a nitrided silicon gate oxide and method
A method of fabricating a transistor includes providing a semiconductor substrate having a surface and forming a nitride layer outwardly of the surface of the...
US-6,716,674 Method of forming a semiconductor package
A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer...
US-6,715,357 Hermetic pressure transducer
A port fitting is formed with a closed, pedestal end forming a diaphragm on which a strain gauge sensor is mounted. A support member is received on the pedestal...
US-6,715,058 Apparatus and method for a sorting mode in a direct memory access controller of a digital signal processor
In order to sort signal group elements organized in blocks in a time-division multiplex protocol into frames of related elements, an address unit addresses the...
US-6,715,000 Method and device for providing high data rate for a serial peripheral interface
An improved high performance scheme is provided with a serial peripheral interface (SPI) to enable microcontroller-based products and other components and...
US-6,714,774 Antenna reception diversity in wireless communications
Antenna reception diversity is provided for wireless communications such that a received signal (r) can be produced by combining antenna signals (v.sub.i) with...
US-6,714,766 Circuit assembly for producing a one-way connection between transmitter and/or receiver units and an antenna
In a circuit assembly for producing a one-way connection between a first transmitter or receiver (12) operating on a first frequency and an antenna (16), on the...
US-6,714,469 On-chip compression of charge distribution data
A method and circuit for measuring a charge distribution for readout from a memory such as a FeRAM uses on-chip compression of bit line voltage measurements. One...
US-6,714,338 MEM's mirror internal sensor linearization based on driver linearity
A technique that reduces or eliminates the non-linearities associated with the internal feedback sensor used in a micro-electro-mechanical mirror assembly. Using...
US-6,714,336 Packaged micromirror assembly with in-package mirror position feedback
A packaged micromirror assembly (21, 21') is disclosed. The assembly (21, 21') includes a mirror element (41) having a mirror surface (29) that can rotate in two...
US-6,714,002 Integrated semiconductor circuit and multi-chip module with a plurality of integrated semiconductor circuits
An integrated semiconductor circuit (10) with function inputs (14a) and function outputs (16a), as well as with function units (12), which supply the function...
US-6,713,881 Semiconductor device and method of manufacturing same
Object: To provide sufficient connection strength between the bonding pads and conductor wires in a wire bonding method. Means for Solution: The bonding pads 20 upon...
US-6,713,852 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin
A leadframe for use with integrated circuit chips comprising a base metal having a plated layer of nickel fully covering said base metal; a plated layer of pure...
US-6,713,851 Lead over chip semiconductor device including a heat sink for heat dissipation
The invention relates to an LOC type semiconductor device having improved heat radiation. The semiconductor device related to the present invention has a...
US-6,713,848 Output stage layout for minimum cross coupling between channels
An audio amplifier output stage layout technique achieves minimum cross coupling between audio amplifier channels. Regarding TDAA output stages, the typical TDAA...
US-6,713,676 System and method for converting a DC input voltage to a DC output voltage
A system for converting a DC input voltage to a DC output voltage includes at least one integrated circuit die electrically coupled to a leadframe. An inductor...
US-6,713,402 Methods for polymer removal following etch-stop layer etch
Cleaning methods are disclosed for removing sidewall polymers from interconnect vias or trenches, wherein a wafer is exposed to a plasma comprising hydrogen and...
US-6,713,361 Method of manufacturing a bipolar junction transistor including undercutting regions adjacent to the emitter...
According to one embodiment of the invention, a method for manufacturing bipolar junction transistors includes disposing a first oxide layer between a...
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