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Patent # Description
US-8,569,082 Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material...
US-8,566,659 Generator and compactor adaptor for low power divided scan path
A Scan-BIST architecture is adapted into a low power Scan-BIST architecture. A generator 102, compactor 106, and controller 110 remain the same as in the known...
US-8,566,621 Method for implementing thermal management in a processor and/or apparatus and/or system employing the same
A method for detecting temperature associated with a processor, results of the detecting being used for controlling power dissipation associated with the...
US-8,564,724 Ghosting artifact reduction in temporal noise filtering
A method of noise filtering of a digital video sequence to reduce ghosting artifacts, the method including computing motion values for pixels in a frame of the...
US-8,564,351 Clock phase compensation for adjusted voltage circuits
Clock phases of clock signals in a dual clock tree are adjusted to compensate for variances in propagation delays of buffers in the clock tree. A first input...
US-8,302,047 Statistical static timing analysis in non-linear regions
A method is described for simulating the f-sigma timing path delay of an integrated circuit design when local transistor variations determine the stochastic...
US-8,301,946 Inverted TCK access port selector with normal TCK data flip-flop
The disclosure describes a novel method and apparatuses for allowing a controller to select and access different types of access ports in a device. The...
US-8,301,944 State machine select inputs coupled to TDI, TCK, and TMS
A TAP linking module (21, 51) permits plural TAPs (TAPs 1-4) to be controlled and accessed from a test bus (13) via a single TAP interface (20).
US-8,301,928 Automatic wakeup handling on access in shared memory controller
A hardware based wake-up scheme initiates memory power-up upon a normal access to a powered down memory. The access that triggered the power-up is buffered....
US-8,301,431 Apparatus and method for accelerating simulations and designing integrated circuits and other systems
A method of accelerating a Monte Carlo (MC) simulation for a system including a first component having a first input parameter and a second component having a...
US-8,301,105 Receiver front end
A low-power receiver front-end includes a transconductance amplifier that produces a single-ended current signal in response to a single-ended voltage signal....
US-8,300,703 System and method for adaptively allocating resources in a transcoder
An adaptive transcoder is provided that includes a shared memory containing a plurality of decoder buffers to store incoming data packets, a plurality of...
US-8,300,561 Methods and apparatus for canceling distortion in full-duplex transceivers
Methods and apparatus for canceling distortion in full-duplex transceivers are disclosed. Some example methods to reduce distortion in a full-duplex transceiver...
US-8,300,510 Laser diode write driver
A laser diode write driver is described. This laser diode write driver comprises: a feedback loop coupled for receiving an input current signal, the feedback...
US-8,300,451 Two word line SRAM cell with strong-side word line boost for write provided by weak-side word line
An integrated circuit having a static random access memory (SRAM) includes an array of SRAM cells arranged in rows and columns having a write word line and a...
US-8,300,446 Ferroelectric random access memory with single plate line pulse during read
A ferroelectric random access memory (FRAM) with reduced cycle time. During a read cycle, plate line voltages are boosted to a voltage to both transfer charge...
US-8,299,827 High-speed frequency divider and a phase locked loop that uses the high-speed frequency divider
A frequency divider includes a least significant (LS) stage, multiple cascaded divider stages, and an output stage. The LS stage receives an input signal, a...
US-8,299,612 IC devices having TSVS including protruding tips having IMC blocking tip ends
A through substrate via (TSV) die includes a plurality of TSVs including an outer dielectric sleeve, an inner metal core and protruding TSV tips including...
US-8,299,588 Structure and method for uniform current distribution in power supply module
A synchronous Buck converter in a molded package (thickness 101 between 0.8 and 1.0 mm) has vertically assembled control (110) and sync (120) power FET chips...
US-8,299,464 Comparator receiving expected and mask data from circuit pads
Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the...
US-8,298,947 Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles
A semiconductor device has a chip (101) with gold studs (212) assembled on a tape substrate (102), which has solder balls (103) for attachment to external...
US-8,298,944 Warpage control for die with protruding TSV tips during thermo-compressive bonding
A method of fabricating through silicon via (TSV) die includes depositing a first dielectric layer on a substrate that includes a plurality of TSV die. The TSV...
US-8,298,874 Packaged electronic devices having die attach regions with selective thin dielectric layer
A method for forming a packaged electronic device including a package substrate having a top substrate surface including a die attach region including at least...
US-8,298,870 Method for connecting integrated circuit chip to power and ground circuits
In a method for transferring at least one of power and ground signal between a die and a package base of a semiconductor device, a connector is formed there...
US-8,298,863 TCE compensation for package substrates for reduced die warpage assembly
A method for assembling die packages includes attaching contacts on a first side of a plurality of first die to substrate pads on a top surface of a composite...
US-8,298,854 Method of manufacturing PIN photodiode
The objective of this invention is to provide a type of photodiode and the method of manufacturing the photodiode characterized by the fact that it has a higher...
US-8,297,472 Pellet loader with pellet separator for molding IC devices
A pellet loading apparatus includes a tablet pusher including a support surfaces including a pusher mechanism coupled thereto for vertical movement upon...
US-8,296,714 System and method for checking analog circuit with digital checker
Aspects of the present invention provide a system and method for checking a portion of an analog circuit using a digital checker. The method includes...
US-8,296,701 Method for designing a semiconductor device based on leakage current estimation
A method of designing a semiconductor device includes preparing a first design for a semiconductor device and estimating leakage current for the first design....
US-8,296,628 Data path read/write sequencing for reduced power consumption
A solid-state memory such as a ferroelectric random access memory (FeRAM) with multiplexed internal data bus and reduced power consumption on data transfer. The...
US-8,296,614 Moving data through test control register with state machine states
Functional circuits and cores of circuits are tested on integrated circuits using scan paths. Using parallel scan distributor and collector circuits for these...
US-8,296,607 Serialization module separating pipelined trace-worthy event and sync packet data
A method and/or a system of a processor-agnostic encoded debug architecture in a pipelined environment is disclosed. In one embodiment, a method of a processor...
US-8,295,396 System and method for power control in a wireless transmitter
A system and method for power control in a wireless transmitter. A power control loop includes a feed forward unit coupled to a data source, the feed forward...
US-8,295,262 Uplink reference signal for time and frequency scheduling of transmissions
A method for multiplexing reference signal (RS) transmissions from user equipments (UEs), with the RS having a bandwidth larger than the data signal bandwidth...
US-8,294,473 Cable detector
A cable detector includes one or more peak detectors that detect when a termination impedance is missing from the output of a line driver. A peak detection...
US-8,294,451 Smart sensors for solar panels
A solar panel smart sensor system is disclosed. The sensor system permits solar power system owners and operators to monitor the voltage of individual panels in...
US-8,294,388 Driving system with inductor pre-charging for LED systems with PWM dimming control or other loads
A method includes receiving a control signal associated with a load, where the control signal is to cause a load change from a perspective of a switching-mode...
US-8,294,261 Protruding TSV tips for enhanced heat dissipation for IC devices
An integrated circuit (IC) device includes a substrate having a top surface including substrate pads, and a through substrate via (TSV) die including a...
US-8,294,243 Lateral bipolar transistor with compensated well regions
Conduction between source and drain or emitter and collector regions is an important characteristic in transistor operation, particularly for lateral bipolar...
US-8,294,218 Method of fabricating an integrated circuit with gate self-protection, and an integrated circuit with gate...
An integrated circuit with gate self-protection comprises a MOS device and a bipolar device, wherein the integrated circuit further comprises a semiconductor...
US-8,294,210 High voltage channel diode
A channel diode structure having a drift region and method of forming. A charge balanced channel diode structure having an electrode shield and method of forming.
US-8,293,573 Microarray package with plated contact pedestals
A microarray package includes a leadframe having an array of contact posts, a die carried by the lead frame, and a plurality of bonding wires that electrically...
US-8,291,435 JEK class loader notification
A method and system for performing class loader notification. At least some of the illustrative embodiments are methods comprising raising a notification during...
US-8,291,354 Merging sub-resolution assist features of a photolithographic mask
Merging sub-resolution assist features includes receiving a mask pattern that includes the sub-resolution assist features. A first sub-resolution assist feature...
US-8,291,254 High speed digital bit stream automatic rate sense detection
As part of the protocol for Common Public Radio Interface/Open Base Station Architecture Initiative (CPRI/OBSAI) systems, multiple data rates are supported,...
US-8,290,492 Handover for DVB-H
A method of wireless handover in a broadcast network (FIGS. 5 and 8) is disclosed. A wireless receiver (FIG. 4) receives a first signal (N) from a first...
US-8,290,113 Frequency synthesizer prescaler scrambling
Various apparatuses, methods and systems for frequency dividing a clock signal are disclosed herein. For example, some embodiments of the present invention...
US-8,290,098 Closed loop multiple transmit, multiple receive antenna wireless communication system
A wireless receiver (74) for receiving signals from a transmitter (72). The transmitter comprises a plurality of transmit antennas (TAT.sub.1', TAT.sub.2') for...
US-8,290,084 Space time transmit diversity for TDD/WCDMA systems
A circuit is designed with a matched filter circuit including a plurality of fingers (700, 702, 704) coupled to receive a data symbol. Each finger corresponds...
US-8,290,024 Methods and apparatus to facilitate improved code division multiple access receivers
Methods and apparatus to facilitate improve code division multiple access (CDMA) receivers are disclosed. An example method disclosed herein comprises:...
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